• Date：6 月 19, 2024
• Location： Online

10:00 AM CEST / 1:30 PM IST | Wednesday, June 19, 2024 | Check Your Time

Registration Deadline: ONE DAY BEFORE THE WEBINAR.
The join link will not be provided to the registration on the webinar day.

In the thriving semiconductor industry, the complexity and precision requirements of IC packaging have become increasingly vital due to the demands of advanced processes. This webinar will provide an overview of the challenges faced by the IC packaging industry, as well as the technological trends in advanced packaging and processes. It will also offer a brief introduction of the digital twin solution provided by Moldex3D IC Packaging.

What You Will Learn

• An overview of the IC packaging industry challenges
• Technological trends in advanced packaging
• An introduction of Moldex3D IC Packaging solutions