Product Portfolio and Features
● Essential features contained ○ Optional features
| eDesign | Professional | Advanced | |
|---|---|---|---|
|
Product Package & Mesh Technology |
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| True 3D Mesh | |||
| eDesign | ● | ● | ● |
| Boundary Layer Mesh, Tetra | ● | ● | |
| Solid (Hexa, Prism, Pyramid, Hybrid) | ● | ||
| 2.5D Mesh | |||
| Shell | ● | ||
|
Standard Injection Molding |
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| Solver Capabilities | |||
| Simultaneous Analysis (max.) | 1 | 1 | 3 |
| Parallel Processing (PP) | 4 | 8 | 12 |
| Thermoplastic Injection Molding | ● | ● | ● |
| Reaction Injection Molding (RIM) | ● | ● | ● |
| Simulation Capabililties | |||
| Filling | ● | ● | ● |
| Surface Defect Prediction | ● | ● | ● |
| Venting Analysis | ● | ● | ● |
| Gate Location | ● | ● | ● |
| Cold & Hot Runners | ● | ● | ● |
| Runner Balancing | ● | ● | ● |
| Packing | ● | ● | ● |
| Cooling | ● | ● | ● |
| Transient Mold Cooling or Heating | ● | ● | ● |
| Conformal Cooling | ● | ● | ● |
| 3D Coolant CFD | ○ | ● | ● |
| Rapid Temperature Cycling | ● | ● | ● |
| Induction Heating | ● | ● | ● |
| Heating Elements | ● | ● | ● |
| Warpage | ● | ● | ● |
| Insert Molding | ● | ● | ● |
| Multi-shot Sequential Molding | ● | ● | ● |
|
Solution Add-on |
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| CAD Interoperability | |||
| SYNC | ○ | ○ | ○ |
| Moldex3D CADdoctor | ○ | ○ | ○ |
| Moldex3D Cooling Channel Designer (CCD) | ○ | ○ | ○ |
| Fiber Reinforced Plastics | |||
| Fiber | ○ | ○ | ○ |
| Stress | ○ | ○ | ○ |
| FEA Interface | ○ | ○ | ○ |
| Micromechanics Interface | ○ | ○ | ○ |
| Moldex3D Digimat-RP | ○ | ○ | ○ |
| DOE | |||
| Expert | ○ | ○ | ○ |
| Thermal Management | |||
| Advanced Hot Runner | ○ | ○ | ○ |
| In-Mold Decoration (IMD) | ○ | ○ | |
| Optical | |||
| Optics | ○ | ||
| Viscoelasticity (VE) | ○ | ○ | ○ |
| Special Molding Processes | |||
| Powder Injection Molding (PIM) | ○ | ○ | ○ |
| Foam Injection Molding | ○ | ○ | ○ |
| Gas-Assisted Injection Molding (GAIM) | ○ | ○ | |
| Water-Assisted Injection Molding (WAIM) | ○ | ○ | |
| Co-Injection | ○ | ○ | |
| Bi-Injection | ○ | ○ | |
| PU Chemical Foaming | ○ | ○ | |
| Compression Molding (CM) | ○ | ||
| Injection Compression Molding (ICM) | ○ | ||
| Resin Transfer Molding (RTM) | ○ | ||
- Moldex3D SYNC supports PTC® Creo®, NX, and SOLIDWORKS ®.
- Moldex3D FEA Interface supports Abaqus, ANSYS, MSC.Nastran, Nastran, NX Nastran, LS-DYNA, MSC.Marc, and Radioss.
- Moldex3D Micromechanics Interface supports Digimat and CONVERSE.
- Database: Thermoplastics materials, thermoset materials, molding materials, coolant materials, and mold materials.
システム要求 (System Requirements)
A. サポートされるプラットフォーム
| Platform | OS | Remark |
| Windows / x86-64 |
Windows 10 family |
Moldex3D 2020 は、Windows 10プラットフォームを経て認証済み *: Update to KB2919355or newer version required |
| Linux / x86-64 |
CentOS 6 family |
Linuxプラットフォームは、計算にのみ使用。ライセンス管理、フロントエンドプロセッサーとバックエンドプロセッサーはLinuxプラットフォームをサポートしません。 |
B. ハードウェア仕様
| 基本 | |
| CPU | Intel® Core i7 Sandy Bridge seriesプロセッサー |
| RAM | 16 GB RAM |
| HDD | 1 TBの使用可能容量 |
| 推奨 | |
| CPU | Intel® Xeon Platinum 8000 seriesプロセッサー* |
| RAM | 64 GB RAM |
| HDD | 4 TBの使用可能容量 |
| Graphic Card | NVIDIA Quadro series, AMD Radeon series |
| Screen Resolution | 1920 x 1080 |
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Intel Xeon E5-1620は推奨される仕様であり、公式benchmark(4x8G RAM)に適用されます。このCPUには4個の最大帯域幅51.2GB/sのメモリチャンネルがあります。各CPUコアのメモリチャンネルあたりの帯域幅は、12.8GB/sです。 https://ark.intel.com/products/64621/Intel-Xeon-Processor-E5-1620-10M-Cache-3_60-GHz-0_0-GTs-Intel-QPI
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注： 計算のパフォーマンスと安定を増加するため、RC/DMP 下のHyper-Threading RC/DMPを閉じるようお勧めします。