Product Portfolio and Features
Standard | eDesign Plus | Professional | AEP | |
---|---|---|---|---|
Mesh Technology |
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Boundary Layer Mesh (BLM) | ● | ● | ● | |
eDesign | ● | ● | ● | ● |
Solid (Hexa, Prism, Pyramid, Hybrid) | ○ | ● | ||
Shell (2.5D Mesh) | ○ | ● | ||
Standard Injection Molding |
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Solver Capabilities | ||||
Simultaneous Analysis (max.) | 1 | 1 | 1 | 3 |
Parallel Processing (PP) | 8 | 8 | 8 | 24 |
Material Database 1 | ● | ● | ● | ● |
Material Hub Cloud (MHC) 2 | ○ | ○ | 1 | 3 |
Thermoplastic Injection Molding (IM) | ● | ● | ● | ● |
Reaction Injection Molding (RIM) | ● | ● | ● | ● |
Simulation Capabililties | ||||
Filling | ● | ● | ● | ● |
Surface Defect Prediction | ● | ● | ● | ● |
Venting Analysis | ● | ● | ● | ● |
Gate Design | ● | ● | ● | ● |
Cold & Hot Runners | ● | ● | ● | ● |
Runner Balancing | ● | ● | ● | ● |
Packing | ● | ● | ● | |
Cooling | ● | ● | ● | |
Transient Mold Cooling or Heating | ● | ● | ● | |
Conformal Cooling | ● | ● | ● | |
3D Coolant CFD | ○ | ● | ● | |
Rapid Temperature Cycling | ● | ● | ● | |
Induction Heating | ● | ● | ● | |
Heating Elements | ● | ● | ● | |
Warpage | ● | ● | ● | |
Insert Molding | ● | ● | ● | ● |
Multi-shot Sequential Molding | ● | ● | ● | |
Solution Add-on |
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Automation & Interoperability | ||||
Expert (DOE) | ○ | ○ | 1 | |
API | ○ | ○ | ○ | 1 |
SYNC 3 | ○ | ○ | ○ | ○ |
Moldex3D CADdoctor | ○ | ○ | ○ | ○ |
iSLM 4 | ○ | ○ | 1 | 3 |
Fiber Reinforced Plastics | ||||
Fiber 5 | ○ | ○ | ○ | ● |
FEA Interface 6 | ○ | ○ | ○ | ○ |
Micromechanics Interface 7 | ○ | ○ | ○ | ○ |
Moldex3D Digimat-RP | ○ | ○ | ○ | ○ |
Advanced Analysis | ||||
Machine Response 8 | ○ | ○ | ○ | ○ |
Plastification | ○ | ○ | ○ | |
Stress | ○ | ○ | ○ | |
Viecoelasticiry (VE) | ○ | ○ | ○ | |
Advanced Hot Runner (AHR) | ○ | ○ | ○ | |
In-Mold Decoration (IMD) | ○ | ○ | ||
Optics | ○ | ○ | ||
Molding Processes | ||||
Powder Injection Molding (PIM) | ○ | ○ | ○ | ○ |
Foam Injection Molding (FIM) | ○ | ○ | ○ | |
Gas-Assisted Injection Molding (GAIM) | ○ | ○ | ||
Water-Assisted Injection Molding (WAIM) | ○ | ○ | ||
Co-Injection Molding (CoIM) | ○ | ○ | ||
Bi-Injection Molding (BiIM) | ○ | ○ | ||
PU Chemical Foaming Molding (CFM) | ○ | ○ | ||
Compression Molding (CM) | ○ | ○ | ||
Injection Compression Molding (ICM) | ○ | ○ |
- Database: Thermoplastics materials, thermoset materials, molding materials, coolant materials, and mold materials.
- Material Hub Cloud (MHC) is a cloud database offering over 8,000 data entries to find suitable materials, view property data, and find alternatives.
- Moldex3D SYNC supports PTC® Creo®, NX, and SOLIDWORKS®.
- iSLM is an intelligent and interactive data management platform for plastic product development lifecycle.
- Flat Fiber and Flow-Fiber Coupling functions require additional license EnhancedFiber.
- Moldex3D FEA Interface supports Abaqus, Ansys, MSC Nastran, NX Nastran, LS-DYNA, MSC Marc, and OptiStruct.
- Moldex3D Micromechanics Interface supports Digimat and CONVERSE.
- Machine Response function requiresthe machine file received from Machine Characterization service.
システム要求 (System Requirements)
A. サポートされるプラットフォーム (Supported Platform)
Windows |
Windows 10, Server 2019 |
Linux |
CentOS 7 series, CentOS 8 series, RHEL 7 series, RHEL 8 series (Solver and LM only) |
B. ハードウェア仕様 (Hardware Recommendation)
基本 | |
CPU | AMD Ryzen™ 7 series, Intel ® Core™ i7 series |
RAM | 16 GB RAM |
HDD | 20 GB free space (For Program Installation) |
推奨 | |
CPU | AMD EPYC™ Milan/Milan-X series, Intel® XEON® Gold/Platinum/Bronze series |
RAM | 16GB x 8 With ECC / 3200Mhz |
HDD | 4 TB SSD (For Project Management) |
Graphic Card | NVIDIA Quadro series, AMD Radeon series |
Screen Resolution | 1920 x 1080 |
- To increase calculation efficiencyand stability, it is recommended to switch off Hyper-Threading under RC/DMP structure.
- メモリー数のルールにつきまして、最適化された性能を得るため、CPUプロセッサーのタイプをご参照ください。