Product Portfolio and Features
● Essential features contained ○ Optional features
| Standard | eDesign Plus | Professional | AEP | |
|---|---|---|---|---|
|
Mesh Technology |
||||
| Boundary Layer Mesh (BLM) | ● | ● | ● | |
| eDesign | ● | ● | ● | ● |
| Solid (Hexa, Prism, Pyramid, Hybrid) | ○ | ● | ||
| Shell (2.5D Mesh) | ○ | ● | ||
|
Standard Injection Molding |
||||
| Solver Capabilities | ||||
| Simultaneous Analysis (max.) | 1 | 1 | 1 | 3 |
| Parallel Processing (PP) | 8 | 8 | 8 | 24 |
| Material Database 1 | ● | ● | ● | ● |
| Material Hub Cloud (MHC) 2 | ○ | ○ | 1 | 3 |
| Thermoplastic Injection Molding (IM) | ● | ● | ● | ● |
| Reaction Injection Molding (RIM) | ● | ● | ● | ● |
| Simulation Capabililties | ||||
| Filling | ● | ● | ● | ● |
| Surface Defect Prediction | ● | ● | ● | ● |
| Venting Analysis | ● | ● | ● | ● |
| Gate Design | ● | ● | ● | ● |
| Cold & Hot Runners | ● | ● | ● | ● |
| Runner Balancing | ● | ● | ● | ● |
| Packing | ● | ● | ● | |
| Cooling | ● | ● | ● | |
| Transient Mold Cooling or Heating | ● | ● | ● | |
| Conformal Cooling | ● | ● | ● | |
| 3D Coolant CFD | ○ | ● | ● | |
| Rapid Temperature Cycling | ● | ● | ● | |
| Induction Heating | ● | ● | ● | |
| Heating Elements | ● | ● | ● | |
| Warpage | ● | ● | ● | |
| Insert Molding | ● | ● | ● | ● |
| Multi-shot Sequential Molding | ● | ● | ● | |
|
Solution Add-on |
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| Automation & Interoperability | ||||
| Expert (DOE) | ○ | ○ | 1 | |
| API | ○ | ○ | ○ | 1 |
| SYNC 3 | ○ | ○ | ○ | ○ |
| Moldex3D CADdoctor | ○ | ○ | ○ | ○ |
| iSLM 4 | ○ | ○ | 1 | 3 |
| Fiber Reinforced Plastics | ||||
| Fiber 5 | ○ | ○ | ○ | ● |
| FEA Interface 6 | ○ | ○ | ○ | ○ |
| Micromechanics Interface 7 | ○ | ○ | ○ | ○ |
| Moldex3D Digimat-RP | ○ | ○ | ○ | ○ |
| Advanced Analysis | ||||
| Machine Response 8 | ○ | ○ | ○ | ○ |
| Plastification | ○ | ○ | ○ | |
| Stress | ○ | ○ | ○ | |
| Viecoelasticiry (VE) | ○ | ○ | ○ | |
| Advanced Hot Runner (AHR) | ○ | ○ | ○ | |
| In-Mold Decoration (IMD) | ○ | ○ | ||
| Optics | ○ | ○ | ||
| Molding Processes | ||||
| Powder Injection Molding (PIM) | ○ | ○ | ○ | ○ |
| Foam Injection Molding (FIM) | ○ | ○ | ○ | |
| Gas-Assisted Injection Molding (GAIM) | ○ | ○ | ||
| Water-Assisted Injection Molding (WAIM) | ○ | ○ | ||
| Co-Injection Molding (CoIM) | ○ | ○ | ||
| Bi-Injection Molding (BiIM) | ○ | ○ | ||
| PU Chemical Foaming Molding (CFM) | ○ | ○ | ||
| Compression Molding (CM) | ○ | ○ | ||
| Injection Compression Molding (ICM) | ○ | ○ | ||
- Database: Thermoplastics materials, thermoset materials, molding materials, coolant materials, and mold materials.
- Material Hub Cloud (MHC) is a cloud database offering over 8,000 data entries to find suitable materials, view property data, and find alternatives.
- Moldex3D SYNC supports PTC® Creo®, NX, and SOLIDWORKS®.
- iSLM is an intelligent and interactive data management platform for plastic product development lifecycle.
- Flat Fiber and Flow-Fiber Coupling functions require additional license EnhancedFiber.
- Moldex3D FEA Interface supports Abaqus, Ansys, MSC Nastran, NX Nastran, LS-DYNA, MSC Marc, and OptiStruct.
- Moldex3D Micromechanics Interface supports Digimat and CONVERSE.
- Machine Response function requiresthe machine file received from Machine Characterization service.
システム要求 (System Requirements)
A. サポートされるプラットフォーム (Supported Platform)
| Windows |
Windows 10, Server 2019 |
| Linux |
CentOS 7 series, CentOS 8 series, RHEL 7 series, RHEL 8 series (Solver and LM only) |
B. ハードウェア仕様 (Hardware Recommendation)
| 基本 | |
| CPU | AMD Ryzen™ 7 series, Intel ® Core™ i7 series |
| RAM | 16 GB RAM |
| HDD | 20 GB free space (For Program Installation) |
| 推奨 | |
| CPU | AMD EPYC™ Milan/Milan-X series, Intel® XEON® Gold/Platinum/Bronze series |
| RAM | 16GB x 8 With ECC / 3200Mhz |
| HDD | 4 TB SSD (For Project Management) |
| Graphic Card | NVIDIA Quadro series, AMD Radeon series |
| Screen Resolution | 1920 x 1080 |
- To increase calculation efficiencyand stability, it is recommended to switch off Hyper-Threading under RC/DMP structure.
- メモリー数のルールにつきまして、最適化された性能を得るため、CPUプロセッサーのタイプをご参照ください。