Product Portfolio and Features
Professional Basic | eDesign | Professional | Advanced | |
---|---|---|---|---|
Mesh Technology |
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Boundary Layer Mesh (BLM) | ● | ● | ● | |
eDesign | ● | ● | ● | ● |
Solid (Hexa, Prism, Pyramid, Hybrid) | ● | |||
Shell (2.5D Mesh) | ● | |||
Standard Injection Molding |
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Solver Capabilities | ||||
Simultaneous Analysis (max.) | 1 | 1 | 1 | 3 |
Parallel Processing (PP) | 4 | 4 | 8 | 12 |
Cloud Extension | ● | ● | ● | ● |
Material Database 1 | ● | ● | ● | ● |
Thermoplastic Injection Molding (IM) | ● | ● | ● | ● |
Reaction Injection Molding (RIM) | ● | ● | ● | ● |
Simulation Capabililties | ||||
Filling | ● | ● | ● | ● |
Surface Defect Prediction | ● | ● | ● | ● |
Venting Analysis | ● | ● | ● | ● |
Gate Design | ● | ● | ● | ● |
Cold & Hot Runners | ● | ● | ● | ● |
Runner Balancing | ● | ● | ● | ● |
Machine Response 2 | ○ | ○ | ○ | ○ |
Packing | ● | ● | ● | |
Cooling | ● | ● | ● | |
Transient Mold Cooling or Heating | ● | ● | ● | |
Conformal Cooling | ● | ● | ● | |
3D Coolant CFD | ○ | ● | ● | |
Rapid Temperature Cycling | ● | ● | ● | |
Induction Heating | ● | ● | ● | |
Heating Elements | ● | ● | ● | |
Warpage | ● | ● | ● | |
Insert Molding | ● | ● | ● | ● |
Multi-shot Sequential Molding | ● | ● | ● | |
Solution Add-on |
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CAD Interoperability | ||||
SYNC 3 | ○ | ○ | ○ | ○ |
Moldex3D CADdoctor | ○ | ○ | ○ | ○ |
Fiber Reinforced Plastics | ||||
Fiber 4 | ○ | ○ | ○ | ○ |
FEA Interface 5 | ○ | ○ | ○ | ○ |
Micromechanics Interface 6 | ○ | ○ | ○ | ○ |
Moldex3D Digimat-RP | ○ | ○ | ○ | ○ |
Mechanical | ||||
Stress | ○ | ○ | ○ | |
Machanics | ○ | ○ | ||
Optical | ||||
Viecoelasticiry (VE) | ○ | ○ | ○ | |
Optics | ○ | |||
Design Management and Optimization | ||||
Expert (DOE) | ○ | ○ | ○ | |
Advanced Hot Runner (AHR) | ○ | ○ | ○ | |
In-Mold Decoration (IMD) | ○ | ○ | ||
API | ○ | ○ | ○ | ○ |
Special Molding Processes | ||||
Powder Injection Molding (PIM) | ○ | ○ | ○ | ○ |
Foam Injection Molding (FIM) | ○ | ○ | ○ | |
Gas-Assisted Injection Molding (GAIM) | ○ | ○ | ||
Water-Assisted Injection Molding (WAIM) | ○ | ○ | ||
Co-Injection Molding (CoIM) | ○ | ○ | ||
Bi-Injection Molding (BiIM) | ○ | ○ | ||
PU Chemical Foaming Molding (CFM) | ○ | ○ | ||
Compression Molding (CM) | ○ | |||
Injection Compression Molding (ICM) | ○ | |||
Resin Transfer Molding (RTM) | ○ |
- Database: Thermoplastics materials, thermoset materials, molding materials, coolant materials, and mold materials.
- Machine Response function requiresthe machine file received from Machine Characterization service.
- Moldex3D SYNC supports PTC® Creo®, NX, and SOLIDWORKS ®.
- Flat Fiber and Flow-Fiber Coupling function require additional license EnhancedFiber.
- Moldex3D FEA Interface supports Abaqus, ANSYS, MSC.Nastran, NXNastran, LS-DYNA, MSC.Marc, and OptiStruct.
- Moldex3D Micromechanics Interface supports Digimat and CONVERSE.
システム要求 (System Requirements)
A. サポートされるプラットフォーム (Supported Platform)
Platform | OS | Remark |
Windows / x86-64 |
Windows 10 series |
Moldex3D 2021is certified for Windows 10 |
Linux / x86-64 |
CentOS 7 series |
Linux platform is used for calculation resource only. Moldex3D LM, Pre-processor and post-processor do not support Linux platform |
B. ハードウェア仕様 (Hardware Recommendation)
基本 | |
CPU | Intel® Core i7 Sandy Bridge series |
RAM | 16 GB RAM |
HDD | 1 TB free space |
推奨 | |
CPU | Intel® Xeon Platinum 8000 series |
RAM | 64 GB RAM |
HDD | 4 TB free space |
Graphic Card | NVIDIA Quadro series, AMD Radeon series |
Screen Resolution | 1920 x 1080 |
- To increase calculation efficiencyand stability, it is recommended to switch off Hyper-Threading under RC/DMP structure.
- メモリー数のルールにつきまして、最適化された性能を得るため、CPUプロセッサーのタイプをご参照ください。