Webinar: Tips & Tricks: Underfill in IC Packaging

  • Date:8 月 16, 2023
  • Location: Online

5:00 PM JST | Wednesday, August 16, 2023 | Check Your Time

Registration Deadline: ONE DAY BEFORE THE WEBINAR.
The join link will not be provided to the registration on the webinar day.


Moldex3D Underfill supports users to simulate the capillary flow, which is induced by surface tension within underfill under flip chips during filling process and affected by underfill material and contact angel between IC components. However, to handle Moldex3D Underfill analysis well requires more skills than other IC packaging simulations. Here, we would like to share some tips to help users keep the quality of Underfill analysis.

What You Will Learn:

  • Introduction of Underfill Process and Moldex3D Capability
  • Settings of Moldex3D Underfill Analysis
  • Tips of Moldex3D Underfill Analysis



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