- Date：10 月 14, 2026
- Location： Online
10:00 AM CEST / 1:30 PM IST | Wednesday, October 14, 2026 | Check Your Time
Registration Deadline: ONE DAY BEFORE THE WEBINAR.
Moldex3D has developed two key strategies — the Hybrid Model and the Equivalent Bump Group (EBG) Model — to enhance efficiency and accelerate Capillary Underfill (CUF) simulation. These methods not only ensure accuracy but also significantly reduce computation time.
In this webinar, the speaker will give a fundamental introduction to Hybrid CUF and Hybrid EBG CUF. Several practical simulation cases will be presented to help attendees gain a comprehensive understanding of their benefits. Finally, a step-by-step demonstration of Hybrid EBG CUF operation in Moldex3D will be provided.
Key Takeaways:
- Introduction of Moldex3D Hybrid CUF
- Introduction of Moldex3D Hybrid EBG CUF
- How Hybrid CUF & Hybrid EBG CUF improve efficiency
