TAIPEI, TAIWAN, January 13-14, 2011- SoildWorks 2011 VAR Kickoff was coming to an end on January 14, and this event gathered more than one hundred resellers form Greater China region. Moldex3D had an enjoyable time there to interact with our valuable VARs. In this event, Dr. Venny Yang, President of Moldex3D, also gave a speech to introduce Moldex3D product line features. He also addressed that the featured product, eDesignSYNC for SoildWorks, will be released soon. With the integrated technology, designers will be able to ‘synchronize’ their design changes with Moldex3D and acquire precise simulation results for further modification and optimization.

Moldex3D eDesign has been widely adopted as the standard design verification and optimization tool by leading manufacturers globally. At this event, we collected many positive feedbacks from attendees and we highly appreciated their comments. Moldex3D look forward to seeing you in the following events soon!