The latest issue of ANSYS Advantage, Volume 3, Issue 2, 2009, spotlights the business value of engineering simulation. Among the interesting and inspiring articles, Moldex3D and ANSYS team up to simulate microchip encapsulation process successfully.

By leveraging the strengths of two leading software, engineers in the microchip encapsulation industry will be able to visualize the filling pattern and check the critical molding problems such as air traps, voids, wire sweep, paddle shift, etc. Check out the latest article online at https://www.ansys.com/magazine/ immediately.