Innovation Success in Advanced IC Packaging

  • Date:10 月 01, 2013
  • Location: Kanagawa, Japan

Innovation Success in Advanced IC Packaging

While pursuing minimization, high reliability, multi-function and cost reduction considerations. To fulfillhuman’s desire, IC packaging industry has encountered the challenges of shortening the cycle time and solving product defects such as air trapshort shotwire sweep and paddle shift. Moldex3D enables users to observe not only the variation of stress which is given by compounds on chips and paddles during the flow process, but also the stress distribution after warpage. The critical standards for dimensional stability and for mechanical structure couple with the development of IC packaging have driven the underfill process to be the point of IC industry nowadays, too. To overcome the challenges and stay competitive, we sincerely invite you to participate in this seminar to absorb not only the novel technology but also the invaluable practical experience shared by leading industry experts.


Time Content Speaker
13:00-13:30 Sign-in
13:30-13:45 Greeting Speech Johnsea Chen
13:45-14:25 An unique 3D package technology for SiP/MCP – Moldex3D for pre-molded 3D substrate David Yu
CMSC/ IC Service K.K.
14:25-14:35 Break
14:35-15:50 Challenges and solutions in Advanced IC Packaging Molding Process – part1 Rick Wu
CoreTech System
15:50-16:20 Break
16:20-17:35 Challenges and solutions in Advanced IC Packaging Molding Process – part2 Ethan ChiuCoreTech System
17:35-17:50 Technology discussion





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