- Date：10 月 01, 2013
- Location： Kanagawa, Japan
While pursuing minimization, high reliability, multi-function and cost reduction considerations. To fulfillhuman’s desire, IC packaging industry has encountered the challenges of shortening the cycle time and solving product defects such as air trap, short shot, wire sweep and paddle shift. Moldex3D enables users to observe not only the variation of stress which is given by compounds on chips and paddles during the flow process, but also the stress distribution after warpage. The critical standards for dimensional stability and for mechanical structure couple with the development of IC packaging have driven the underfill process to be the point of IC industry nowadays, too. To overcome the challenges and stay competitive, we sincerely invite you to participate in this seminar to absorb not only the novel technology but also the invaluable practical experience shared by leading industry experts.
|13:30-13:45||Greeting Speech||Johnsea Chen
|13:45-14:25||An unique 3D package technology for SiP/MCP – Moldex3D for pre-molded 3D substrate||David Yu
CMSC/ IC Service K.K.
|14:35-15:50||Challenges and solutions in Advanced IC Packaging Molding Process – part1||Rick Wu
|16:20-17:35||Challenges and solutions in Advanced IC Packaging Molding Process – part2||Ethan ChiuCoreTech System|
- Shin Yokohama Prince Hotel 3-4 Shin Yokohama, Kohoku-ku, Yokohama Kanagawa, 222-8533 Japan
- Tel: +81-(0)45-471-1111