- Date:2 月 12, 2025
- Location: Online
10:00 AM CET / 2:30 PM IST | Wednesday, February 12, 2025 | Check Your Time
Registration Deadline: ONE DAY BEFORE THE WEBINAR.
The join link will not be provided to the registration on the webinar day.
Stress analysis is an important CAE tool that helps manufacturers predict the mechanical behavior of their products under certain external conditions. Moldex3D Stress module provides linear and nonlinear stress analysis, with or without considering other analysis results. It can also be used to observe the warpage behavior and stress relaxation following the annealing process.
For more complicated structure analyses, Moldex3D FEA interface can transfer molding analysis results from Moldex3D to other CAE software. With the consideration of manufacturing effects, structural analysis results can then be more accurate.
What You Will Learn
- Introduction of Stress Analysis
- Moldex3D Stress Modulus Application
- Moldex3D FEA Interface Features and Benefits