Moldex3D would like to say thank you to all the visitors who took the time to visit our booth at ECTC during June 1-2, 2011. It was our pleasure and honor to have you visited our booth and products. We had a success exhibition because of your great support.
Due to the tight schedule during the conference, we could not particularly introduce ourselves. We would like to take this opportunity to provide you more detailed information about ourselves.
Moldex3D, founded in 1995, is the largest independent CAE software provider for injection molding process. We are dedicated to help users produce innovative and best-quality product while maintaining lowest development cost and shortest production cycle time. Moldex3D has been adopted by many well-known global companies as reliable solution partner, including Samsung, Ford, Toyota, LG, Sony Ericsson, Foxconn, and many others. Moldex3D has 9 direct offices in Taiwan, China, and United States, and has partnered with more than 100 sales channels throughout the world to provide local, prompt, and professional services to users.
At the ECTC, we presented Moldex3D/Solid – IC Package module to show how it can help users detect potential molding problems and further optimize the microchip encapsulation process. Through IC Package module of Moldex3D, IC packaging engineers are empowered to
- Predict unbalanced mold flow, air trap/void, weld line, die crack, warpage, wire sweep, paddle shift, and underfill related issues.
- Evaluate package and mold designs, and process conditions to achieve innovative and high-quality products.
- Minimizing physical prototypes and test setups to reduce manufacturing cost and product development cycle time.
With a goal of constantly improving ourselves and the quality of our work, any suggestions or comments that you may have are truly appreciated. If you need more information or enquiries about our company or products, please do not hesitate to contact with us. Once again, we are grateful for your visiting and interests in our products. We are looking forward to meeting you again very soon.